|
 |
|||
 |
 |
|||
SI-P850 Solder Paste Printer
Sony introduces the 0.3mm fine-pitch printing of SI-P850 Solder Paste Printer. The unit supports a wide range of stencils including the popular 29” square stencils.
- New literature arriving soon!
- High speed printing is possible with the optional high speed print head and high speed cleaning unit. Sustained sub-20 second print cycles are possible even on assemblies with 0201 and smaller chips.
- Fast change over is easy to accomplish
- High-Precision Reliable Printing: +20 µm and 0.3 mm fine pitch
- Automatic Stencil Cleaning with Roll Paper or Cloth cleaning of targeted areas of the stencil
- User Friendly Touch Panel Interface for Easy Operation
- Automatic paste dispense option provides rock solid paste volume control and reduces waste by more than 40%!
- New literature arriving soon!
 |
|
 |
|
 |
|
 |
|
 |
|
 |
|
 |
|
 |
|
